產品設備與技術productsSCROLL DOWN 首頁 - 產品介紹 - Vulcan VLC-TC1200Vulcan VLC-TC1200設備尺寸：2275 x 2160 x 2350 mm產品洽詢產品詳情 Specification Vulcan Series Chip to Chip VLC-TC1200 入料方式 Tray入料/藍膜入料 Post-bond Accuracy ±0.5μm Bonding Head Amount 2 set Bond Head Size 60mm*60mm Stage Size 圓形 350mm Bonding Force Max. 300N Bonding Temperature(℃) Max. 450℃ 產品詳情產品詳情 Specification Vulcan Series Chip to Chip VLC-TC1200 入料方式 Tray入料/藍膜入料 Post-bond Accuracy ±0.5μm Bonding Head Amount 2 set Bond Head Size 60mm*60mm Stage Size 圓形 350mm Bonding Force Max. 300N Bonding Temperature(℃) Max. 450℃ applicationAR 應用 / 智能車燈解決方案CPO Bond 共封裝光學方案Flip Chip Bond 覆晶封裝方案
