PRODUCT CATEGORIES

NexBond Systems delivers cutting-edge, high-precision wafer bonding solutions for the global semiconductor industry, backed by 100% in-house R&D and manufacturing to ensure agile, customized, and resilient technical support. To address the diverse demands of heterogeneous integration and advanced packaging, our comprehensive portfolio features six core product lines—including the Vulcan, Hemera, and Skadi series for ultimate alignment and stability, the Kratos and Ourea series for complex, high-end processes, and the Hybrid Bonder for ultra-high-density interconnects. NexBond Systems — Connecting your semiconductor future with infinite precision.

半導體封裝設備
致力於為客戶提供全方位的半導體封裝解決方案。
Vulcan Series
具備極致的精準度，鍵合精度可達到0.5μｍ，是專為光學精密元件所設計的機種。