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The Perfect Symbiosis of Precision Technology and Sustainable Development
NexBond Systems regards sustainability as the core of corporate competitiveness. We have established an "ISO and Sustainability Section" within our organizational structure, embedding the spirit of ESG into daily operations and quality management. We believe that by providing high-performance, low-energy precision equipment, we can help the semiconductor supply chain achieve the goal of resource utilization optimization.
Excellence in Precision, Driven by Data
Our Equipment Demonstrates Ultimate Engineering Metrics
±0.5MM
Ultra-High PrecisionThe Vulcan and Hemera series products meet the most cutting-edge packaging requirements.
100%
Automated MeasurementThe mold measurement equipment features dedicated 12-inch alignment and automatic barcode recognition functions.
Full Series
Safety ProtectionAll of our advanced packaging critical equipment strictly complies with SEMI safety standards.
Client Partnerships
Track RecordOur clientele covers global semiconductor leaders such as TSMC, ASE, UMC, and SPIL.
Empowering Future Packaging,
—— Practicing Green Innovation
—— Practicing Green Innovation
Facing advanced process challenges such as HBM multi-layer stacking and CoWoS, NexBond Systems continuously optimizes equipment performance and process yield, reducing waste and energy consumption during production.
We will continue to join hands with global partners to develop equipment featuring high compatibility and long lifespan, contributing to the sustainable ecosystem of the semiconductor industry.
ESG REPORT